Philips Semiconductors Introduces Audio Codec and Touch Screen Controller for Intel XScale-Based Handheld Applications
SAN JOSE, Calif.--(BUSINESS WIRE)--Feb. 13, 2002--Philips
Semiconductors, a division of Royal Philips Electronics
(NYSE:PHG - news; AEX:PHI), today announced the availability of the UCB1400,
an advanced mixed-signal audio codec chip developed for LCD-based
handheld applications. Offering a small form-factor, UCB1400 is an
ideal solution for battery-powered devices such as PDAs, handheld PCs,
Internet-enabled mobile phones and wireless Web terminals. On a single
chip, the UCB1400 combines audio codec functions, a touch-screen
controller and power management interfaces -- features traditionally
requiring two or more ICs. This combination of features means that
handheld manufacturers can build smaller products that run for longer
periods of time on a single charge.
The UCB1400 is fully compliant with Revision 2.1 of Intel's
Audio Codec '97 (AC'97) Component Specification. The integrated AC'97
Rev. 2.1 interface allows the UCB1400 to communicate with the AC Link
host controllers of a variety of embedded processors, such as
Intel's® PXA210 and PXA250 Applications Processors, Intel's
StrongARM® SA-1110 processor and future processors from Intel based
on the Intel® XScale microarchitecture.
"As a member of the Intel® Personal Internet Client Architecture
Developer's Network, Philips Semiconductors is providing components
that enable high quality wireless devices based on Intel building
blocks," said Mark Casey, director of marketing for Intel's Handheld
Computing Division. "Platforms based on Intel PCA building blocks,
such as Intel StrongARM processors, upcoming processors based on the
Intel XScale microarchitecture, and Intel StrataFlash® memory will
enable new levels of multimedia and applications processing for
wireless devices."
The UCB1400 integrates a 20-bit stereo codec for audio processing
and supports programmable sample rates, I/O gain and digital sound
processing including volume, mute, bass and treble controls. In
addition to superior audio processing capabilities, the UCB1400 also
supports a variety of power management features. Individual UCB1400
blocks can be switched off independently when not in use, optimizing
power consumption and maximizing battery-life. The external interface
of the UCB1400 has a total of 48 pins, most of which provide the AC
Link, interrupt, audio, ADC, touch-screen, power and miscellaneous
interfaces. Ten general-purpose pins provide programmable I/O enabling
the host processor to perform control functions and monitor status.
Other features include 3.3 V supply and built-in power saving modes
for portable, and battery-powered applications.
"By working in concert with Intel, Philips Semiconductors is
delivering advanced integration and multimedia performance for
advanced wireless devices," said Tom Dockery, director of product
marketing for Philips Semiconductors' computing business line.
"Philips Semiconductors continues to strive for increased integration
and system flexibility to create living technology in mobile
applications. The UCB1400 device is a perfect example of how we have
successfully applied our connectivity and system solutions to another
industry leading architecture."
Pricing and Availability
The UCB1400 audio codec and touch screen controller chip is
currently sampling with volume production scheduled for the first
quarter of 2002. The UCB1400 is priced at $4.60 in quantities under
1,000 units. Samples can be requested directly from Philips
Semiconductors. For more information, please visit
http://www.semiconductors.philips.com/markets/computing/pda/pda_xcc/.
About Philips Semiconductors
Philips Semiconductors, a top ten semiconductor supplier with
revenues of US$4.4 billion in 2001, is a world leader in silicon
systems and standard products for consumer, communications, automotive
and computing products. The organization designs, develops and
manufactures silicon solutions based on its innovative Nexperia(TM)
architectures to create living technology for its customers creating
products, service providers using the products, and consumers enjoying
the resulting products and services. For more information:
www.semiconductors.philips.com.
Note to Editors: Other product or service names mentioned herein
are the trademarks of their respective owners.
Contact:
Philips Semiconductors
Robyn Kao, +886 2 2134 2968 (Asia PAC)
Robyn.Kao@philips.com
or
Warman & Bannister
Birgit van Gellecom, +31 40 214 60 14 (Europe)
BirgitG@warban.nl
or
The Hoffman Agency
Natalie Kessler, 408/975-3032 (USA)
nkessler@hoffman.com
